Mechanical Bonding: Maintains electrode integrity; prevents active material loss
Electrochemical Stability: Stable in electrolyte; does not decompose or hinder ion/electron transport
Volume Change Adaptation: High elasticity or self-healing. Specific versions for silicon-based anodes
Interface Compatibility: Promotes stable SEI formation; reduces side reactions
Process & Cost: Suitable for slurry coating; low toxicity, eco-friendly, cost-effective
Thermal conductivity: 2.0 W/(m·K)
Room-temperature curing, lap shear strength (Al-Al): 10 MPa
Boosts thermal efficiency by 27% under identical cooling conditions versus 0.5 W/(m·K) materials
Low density and lightweight
Cured density: < 0.3 g/cm³
After self-leveling: begins self-foaming in 3-5 minutes
Curing time: 10-60 minutes
Lightweight Structural Adhesive: Density as low as 0.75 g/cm³, tensile shear strength > 8 MPa
Versatile Platform Potting Compound: Density controlled at ~0.8 g/cm³, providing insulation protection while enabling easy maintenance
Ultra-High Thermal Conductivity Gel: Thermal conductivity up to 6 W/(m·K ), ensuring stable operation of high-power devices
Transparent Potting Adhesive: Suitable for batteries and power modules, offering both aesthetic appeal and reliable encapsulation
Copyright © 2026 Youxing Shark (Shanghai) Science and Technology Co., Ltd. Copyright