Advanced Materials for AI Computing Systems and Electronics & Semiconductors - Youxing Shark (Shanghai) Science and Technology Co., Ltd.

Optical Communication Core Component Solutions

Controlled flow and curing in micron-level gaps, delivering deeply customized process solutions for optical path construction, stress management, environmental protection, and thermal management.

Low CTE, low shrinkage

Low modulus (flexible)

High Tg

Controllable flow and curing in micron-level gaps
Semiconductor Underfill Solution

This solution utilizes self-developed ultra-high-purity modified epoxy resins and tailored electronic-grade spherical fillers. Applied via capillary underfill (CUF) process, it significantly enhances chip structural strength and reliability.

Ultra-low viscosity: 500–6000 mPa·s

High glass transition temperature (Tg ≥ 130°C)

Low coefficient of thermal expansion (CTE α1): < 30 ppm/°C

High fracture toughness, low warpage, reworkable
Optical Film Full Lamination Solution

A precision adhesive solution for optical display films such as brightness enhancement (BEF), quantum dot, prismatic, and composite films. It provides high transparency, stability, and low stress, helping displays in consumer electronics, automotive, and commercial applications achieve higher brightness, better color gamut, and longer lifespan.

Prism Structure Adhesive: Compatible with various film layers to ensure precise optics and display uniformity

DBEF Lamination Adhesive: High transparency, low haze for enhanced backlight efficiency in ultra-thin, bright modules

Quantum Dot Film Adhesive: High-temperature resistant to protect quantum dots and ensure stable wide-color-gamut performance

MOP Lamination Adhesive: Optimizes interlayer stress matching to prevent defects and improve production yield
OLED Display COG Lead Precision Protection Solution

Self-developed high-performance encapsulation materials deliver reliable sealing and long-term environmental stability for OLED display COG (Chip-on-Glass) leads. They effectively prevent corrosion from moisture, ion migration, and mechanical stress, ensuring display module durability in demanding applications.

Excellent weather resistance and flow leveling for complex, delicate structures

Fast curing speed to enhance assembly line efficiency and process stability

Performance benchmarked against industry leaders, meeting high-end module manufacturing standards

Full-process support from dispensing and curing to final protection